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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS LSBI3330/S150 DATA SHEET DOC. NO : REV DATE : QW0905-LSBI3330/S150 A : 18 - Nov. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBI3330/S150 Page 1/4 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 0.5 TYP 25.0MIN 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0 -30 30 -60 60 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBI3330/S150 Page 2/4 Absolute Maximum Ratings at Ta=25 Ratings Parameter Symbol SBI Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 70 120 50 500 -20 ~ +80 -30 ~ +100 Max 260 for 5 sec Max (2mm from body) mA mA mW UNIT A V Electricity or power surge will the Use of anti-electrosatic * Static is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly glove these All equipment and machinery grounded. Typical Electrical & Optical Characteristics (Ta=25 ) COLOR PART NO MATERIAL Emitted LSBI3330/S150 InGaN/SiC Pnm Dnm Forward Peak Dominant Spectral voltage wave wave halfwidth length length nm @20mA(V) Luminous intensity @20mA(mcd) Viewing angle 2 1/2 (deg) Lens Sky Blue Diffused Typ. Max. Min. Typ. 430 465 65 3.8 4.7 65 108 20 Blue Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBI3330/S150 Page 3/4 Typical Electro-Optical Characteristics Curve SBI CHIP Fig.1 Forward current vs. Forward Voltage Forward Current(mA DC) 30 25 20 15 10 5 0 1 2 3 4 5 Fig.2 Relative Intensity vs. Wavelength 1.0 Relative Intensity(%) 0.5 0 380 430 480 530 580 630 680 Forward Voltage(V) Wavelength (nm) Fig.3 Relative Intensity vs. Forward Current 125 Relative Intensity(%) Relative Intensity 0 5 10 15 20 25 30 35 40 45 Forward Current (mA DC) 100 75 50 25 0 Fig.4 Relative Intensity vs. Lead Temperature 10 1 0 0 25 50 75 100 Lead Temperature () Fig.5 Forward Current vs. Ambient Temperature Forward Current (mA DC) 40 30 20 10 0 0 25 50 75 100 Ambient Temperature () LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSBI3330/S150 Page 4/4 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 5 2.Dwell time= 10 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 5 2.Dwell time=5 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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